Method and apparatus for simultaneous write head planarization and lead routing

ABSTRACT

Disclosed is a planarizing layer for use in an MR read/inductive write head combination, and a method for constructing the same. In the preferred embodiment, a planarizing layer comprising a plurality of planar sections of conductive material is formed in the plane of the lower pole piece of an inductive head. The planar sections, in cooperation with the lower pole piece, provide a substantially planar surface on which to form the inductive coil. Two of the planar sections are electrically coupled to respective MR leads, and include protrusions extending from the perimeter of the inductive coil to enable electrical access by a pair of read terminal pads. A third planar section is electrically coupled to the inner coil tap of the inductive coil, and includes a protrusion extending from the perimeter of the inductive coil to enable electrical access by a write terminal pad.

BACKGROUND OF THE INVENTION

The present invention relates generally to a read/write head assemblyfor use in a computer data storage drive, and in particular, to aread/write head having a conductive lead arrangement for providing asubstantially planar surface on which to form an inductive writeelement.

State of the art thin film read/write structures in data storage systemsgenerally include an inductive write head in combination with either aninductive or magnetoresistive (MR) read head.

One type of MR/inductive write head arrangement includes an inductivewrite head assembly formed adjacent to a magnetoresistive read headsubassembly, separated by a layer of gap material. The read headincludes an MR element and corresponding MR leads in a "read gap" formedby two soft magnetic shielding layers. The MR element and leads areelectrically isolated from the shielding layers by an insulatingmaterial in the read gap. The write head includes an inductive coil, amagnetic yoke having upper and lower pole pieces which surrounds aportion of the coil, and insulating material within the yoke toelectrically isolate the yoke from the coil. This type of read/writehead assembly is sometimes referred to as a "piggy-back" structure.

In a second known MR/inductive head combination, the lower pole of themagnetic yoke also serves as one of the shielding layers of the readassembly. Such an arrangement is commonly referred to as a "merged" headdesign.

One disadvantage of the layered structures described above is the unevenor "stepped" topography beneath the inductive coil. The unevenness isprimarily due to the protrusion of the lower pole piece. Although stepabruptness is smoothed to some degree by a layer of insulating materialbeneath the coil, substantial unevenness remains. Consequently,formation of the coil may result in notched or broken resist lines alongthe step ridges, adversely affecting write head performance and yield.

It is therefore desirable to provide a substantially even, planarsurface beneath the inductive coil. U.S. Pat. No. 4,855,854 suggests aplanarization process wherein insulation layers applied before and afterthe formation of an inductive coil are mechanochemically polished tocorrect unevenness. This solution, however, introduces additional stepsto the manufacturing process.

In an alternative solution the lower pole piece is extended along theentire length of the substrate to form a planar surface beneath theinductive coil. In a merged head design, however, such a pole extensionincreases the risk of shorting between the lower pole piece and theshielding layer of the "piggy-back" head or the MR leads of the "merge"head.

A further disadvantage of the "piggy-back" and "merged" head designs isthe required dimensions of the MR leads. In previous designs, the MRleads extended beyond the perimeter of the inductive coil to enableelectrical contact with read terminal pads external to the headassembly. But as read gaps become smaller, the problems of leadresistance and electrical shorting between the leads and the shieldinglayers of the "piggy-back" head, or between the leads and the shieldinglayer and lower pole piece of the "merged" head become greater concerns.It is therefore desirable to reduce the length and total area of the MRleads.

Yet another disadvantage of the previous designs is the necessity for anoverpass connector to the inner coil tap. The overpass connection maycompromise slider height reduction in disk drives with small sliderheight tolerances.

Read/write assemblies are generally formed on either a central or siderail of a slider. In a known center rail arrangement, terminal pads aretypically connected to the MR leads and coil taps in a"write-read-read-write" (WRRW) pattern. However, design constraints mayrequire any arbitrary terminal pad arrangement. This may be the case foreither center rail or side rail designs. It is therefore desirable todevelop a read-write head assembly having a conductive planarizing layerwhich easily facilitates a variety of terminal pad arrangements, and isadaptable to either center rail or side rail designs.

SUMMARY OF THE INVENTION

In view of the foregoing observations, it is therefore an object of thepresent invention to overcome the disadvantages associated withMR/inductive head structures.

Specifically, it is an object of the present invention to provide aplanarizing layer for use with an inductive head to provide asubstantially planar surface in cooperation with the lower pole piece onwhich the coil may be formed.

It is a further object of the present invention to provide a planarizinglayer for use with an MR read/inductive write head assembly whichprovides means for electrical connection between the MR leads andcorresponding read terminal pads on the trailing edge of a slider.

Another object of the present invention is to provide a planarizinglayer for use with an inductive head which provides means for electricalconnection from below between the inner tap and a corresponding writeterminal pad on the trailing edge of a slider.

It is a furthers object of the present invention to provide a method foradding a planarization layer to an inductive head assembly.

Another object of the present invention is to provide an inductive writehead including a planarization layer for improved head yield andperformance.

A further object of the present invention is to provide an inductivewrite head including a planarizing layer below the inductive coil whichprovides electrical connection between a slider terminal pad and theinner coil tap.

It is a further object of the present invention to provide an MRread/inductive write head assembly including a planarizing layer belowthe inductive coil which provides electrical connection between the MRleads and the slider read terminal pads in a manner which does notrequire the MR leads to extend beyond the perimeter of the inductivecoil.

Another object of the present invention is to provide a conductiveplanarizing layer in the plane of the lower pole piece to facilitatealternative terminal pad arrangements arising due to design constraints.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other objects, features and advantages of the presentinvention will be apparent from the following detailed description ofthe preferred embodiments, with reference to the accompanying figures ofthe drawings, in which:

FIG. 1 is a cross-sectional view of a known magnetoresistivesensor/inductive write head assembly;

FIG. 2(a) is across-sectional view of a known "merged" magnetoresistivesensor/inductive write head assembly;

FIG. 2(b) is a detailed perspective cross-sectional view of the layersin the merged head assembly of FIG. 2(a);

FIG. 3 is a plane view of an inductive write coil having an "overpass"outer coil tap connector;

FIG. 4 is a plane view of a known center rail slider design having aWRRW terminal pad arrangement;

FIG. 5(a) is a plane view of the preferred embodiment of the presentinvention;

FIG. 5(b) is across-sectional view of a preferred embodiment of a mergedhead assembly having a planarizing layer;

FIG. 6 is a plane view of the MR leads in the preferred embodiment of amerged head assembly with a planarizing layer;

FIG. 7 is a plane view of the lower pole piece and an insulating layerof the preferred merged head assembly shown in relation to the MR leadsof FIG. 6;

FIG. 8 is a plane view of the preferred embodiment of the planarizinglayer for a center-rail merged head design connected in a WRRW terminalpad arrangement;

FIG. 9 is a plane view of the inductive write coil, insulating layer andterminal pad connectors formed over the planarization layer of FIG. 8;

FIG. 10 is a composite of FIGS. 7, 8 and 9;

FIG. 11 is the read-write head assembly of FIG. 10 shown in relation toterminal pads arranged in a WRRW configuration;

FIGS. 12(a) and (b) are plane views of the preferred embodiment of aplanarizing layer in a center-rail head design having a RRWW terminalpad arrangement;

FIGS. 13(a) and (b) are plane views of the preferred embodiment of aplanarizing layer in a center-rail head design to be connected in eithera WRRW or a RRWW terminal pad arrangement;

FIGS. 14(a)-(d) are plane views of the preferred embodiment of aplanarizing layer in a side-rail design connected in four alternativeterminal pad arrangements; and

FIG. 15 is a simplified block diagram of a magnetic disk storage systemembodying the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT

One type of MR/inductive write head arrangement is shown in FIG. 1. Itincludes a magnetoresistive head subassembly 24 with first and secondsoft magnetic shielding layers 12, 16 defining a read gap 13; an MRelement 14 disposed in the read gap 13; a pair of planar conductingleads 45, 46 in contact with the MR element 14 and extending from thesubassembly 24 (only one visible); and insulating material 26 in the gap13 for electrically isolating the MR element and corresponding leadsfrom the shielding layers 12, 16. The shielding layers 12, 16 typicallycomprise a soft ferromagnetic material such as sendust or NiFe, and areformed by conventional methods such as chemical vapor deposition (CVD)or sputtering or plating. The insulating material 26 comprises anymaterial suitable for electrically isolating the conductive layers ofthe read head, e.g. Al₂ O₃, SiO₂, etc. The read gap is usually formed byfirst applying a layer of insulating material to shielding layer 12 byconventional means. The MR element 14 is then formed by subtractiveetching or another suitable process, and leads 45, 46, such as thoseshown in FIG. 4, are formed thereon, e.g., by methods such aselectro-plating, sputtering or evaporation. Another layer of insulatingmaterial is then applied over the MR element 14 and leads 45, 46.Finally, the second shielding layer 16 is formed over the completed readgap 13.

The inductive write head subassembly is formed adjacent to the read headsubassembly and is electrically isolated from the same by an insulatinggap layer 29. The subassembly includes an inductive coil 19 having aninner tap 27 and an outer hap (not shown), a magnetic yoke comprisingfirst and second pole pieces 22, 23 connected at the coil center 9 toform a back gap, insulating material 18 over the coil 19 and between thepole pieces 22, 23 to electrically isolate the coil 19 from the yoke,and a conductor 28 coupled to an external write terminal pad (not shown)passing over the coil to contact the inner coil tap 27. Note that theturns of the coil external to the yoke are not level with the turnswithin the yoke. The gap layer 29 comprises insulating material such asAl₂ O₃ or SiO₂ applied by conventional means such as sputtering or CVD.The lower pole piece 22 is formed on the gap layer 29 by a suitablemethod such as electro-plating or sputtering. Insulating material 18 isapplied over the lower pole piece 22 to provide an electricallyinsulated surface on which to form the inductive coil 19. A back portionof the pole piece is kept exposed by a via hole formed in the insulatingmaterial 18 for later access by the upper pole piece 23. The inductivecoil 19 is applied, e.g., by electro-plating successive copper layersonto the insulating material over lower pole piece 22. The coil 19 iscoated with more insulating material 18 to electrically isolate it fromthe upper pole piece 23, which is applied next by conventional meanssuch as electro-plating or subtractive etching. The read/write headassembly just described is sometimes referred to as a "piggy-back"structure.

FIGS. 2(a) and (b) illustrate a second known MR/inductive headcombination in which first pole piece 22 also serves as the secondshielding layer 16 of the read assembly 24 of FIG. 1. Again, note theunevenness of the coil turns in FIG. 2(a). Such an arrangement iscommonly referred to as a "merged" head design.

An overpass connector 28 which has been used with previous read/writehead assemblies is shown in FIG. 3. Connector 28 provides electricalcoupling between a write terminal pad (not shown) and the inner tap 27of the inductive coil 19. The connector 28 has access to the inner coiltap 27 through a via hole 20 formed in the insulating material 18.

FIG. 4 depicts the trailing edge 30 of a slider having a centrallypositioned read/write head assembly 50 with terminal pads 41-44symmetrically arranged on either side. The outer terminal pads 44, 41are connected to the inner and outer coil taps 27, 37 of inductive coil19, respectively. The inner terminal pads 42, 43 are connected to MRleads 45, 46 extending out from beneath the coil 19. Note that the MRleads extend beyond the perimeter of the inductive coil 19 to enableaccess by the read terminal pads 42, 43. The terminal pads 41-44 areshown in a write-read-read-write arrangement.

FIG. 5(a) is a preferred embodiment of the planarizing layer of thepresent invention. The primary objective of the planarizing layer is toprovide a planar surface in cooperation with the lower pole piece 22 onwhich the inductive coil 19 may be formed. In the preferred embodiment,two additional functions are served: 1) the layer provides means forelectrically connecting the MR leads of the read head subassembly 24 tocorresponding read terminal pads; and 2) it provides means forelectrically connecting the inner coil tap 27 of the inductive coil 19to a corresponding write terminal pad.

The conductive layer comprises three planar sections 86-88 of aconductive metal or a permalloy. Examples of suitable materials includeCu, Au, Pt, Ta, Ti, Rh, Ru, Ag, Pd, W and NiFe. Each section iselectrically isolated from the others so that it may serve anindependent conductive function. Yet the sections 86-88 are designed tofit in close proximity to one another and to the coated lower pole piece22, thereby forming a highly planar surface for the inductive coil 19.Each planar section is carefully positioned with respect to itsconductive function. That is, when the planar arrangement is included inan MR read/inductive write head, section 86 is positioned over a firstMR lead, section 88 is disposed over a second MR lead, and section 87 isdirectly below the inner coil tap, thereby facilitating functions 2) and3) (above) of the planarizing layer. The conductive functions arefurther facilitated by protrusions 56-58, which are designed to extendbeyond the perimeter of the inductive coil for easy access by theterminal pads. The protrusions make the MR leads 51, 52 shown in FIG. 6and inner coil tap 27 accessible to the terminal pads via the conductiveplanar pieces 86-88.

FIG. 5(b) shows a cross-section of a merged MR/inductive write headhaving the planarizing layer 53 of the present invention (indicated bythe dashed lines). The planarizing layer 53 of FIG. 5(b) extendsvertically to the level of lower pole piece 22. Note that all of theinductive coil turns 19 are level. The preferred embodiment of a mergedhead design including the planarizing layer of the present inventionwill be described next, with reference to FIGS. 2(b), and 5-10.

In FIGS. 5(a) and (b), a magnetoresistive head subassembly 24 is formedon a substrate 11 in the same manner as described with reference to FIG.2. Since two of the planar sections 86, 88 will provide electricalaccess to the MR leads, the leads themselves are no longer required toextend beyond the perimeter of the inductive coil and may be muchsmaller than those of the prior art. The reduced MR leads 51, 52 of tilepreferred embodiment are shown in FIG. 6.

Referring again to FIG. 5(b), a write head subassembly 25 including theplanarizing layer 53 is formed over read head subassembly 24. Section 87of the planarizing layer 53 electrically couples to the inner coil tap27 from below, so that the need for an overpass connector 28 iseliminated. The write head 25 is constructed by first forming a lowerpole piece 22 on the gap layer 13 of the read head subassembly 24. Thelower pole piece 22 is constructed by conventional methods such aselectro-plating, sputtering, or CVD. The lower pole piece 22 is nextcoated with an insulating layer 58. Via holes 73, 74 formed in theinsulating layers 13, 58 expose MR leads 51, 52 for later access by theplanarizing layer 53, as shown in FIG. 7. The planarizing layer 53 isthen formed on the insulating layer 58 to substantially the same levelas the coated first pole piece 22, thereby providing a substantiallyplanar surface beneath the inductive coil 19.

In the preferred embodiment, the planarizing layer 53 comprises aplurality of conductive elements 86-88 formed by applying a Cu seedlayer to the insulating layer 58, and electro-plating thereon to thelevel of the pole piece 22. In the preferred embodiment, read and writeterminal pads 41-44 are also plated about the head structure at thisstage to form a symmetrical arrangement like that of FIGS. 4 and 11.Another insulating layer 71 is applied over the planarizing layer 53,electrically isolating the same from the inductive coil 19 and smoothingout small gaps 89 between the planar pieces 86-88. FIG. 8 illustratesthe planarizing layer of FIG. 5(a) and insulating layer 71, includingvia holes 72, 81-84 formed, e.g., by conventional photomask patterningof the insulating material. Via holes 82-84 formed over protrusions56-58 provide the means by which the terminal pad connectors will accessplanar sections 86-88. Via hole 81 provides means for planar section 87to electrically couple to the inner coil tap 27, and via hole 72 keepsthe back end of lower pole piece 22 accessible for later coupling toupper pole piece 23.

Referring to FIG. 9, the inductive coil 19 and terminal pad connectors96-99 are formed on the insulating layer 71 by conventional methods suchas metal electro-plating. Again, any suitable conductive material suchas Cu, Au, etc., may be used to build the coil. One end of each terminalpad connector 96-99 is plated directly onto the terminal pads 41-44shown in FIG. 11. Once the coil 19 is completed, inner coil tap 27 iselectrically coupled to conductive element 87 through via hole 81 andouter coil tap 37 forms a portion of write terminal pad connector 99.Terminal pad connectors 96-98 are electrically coupled to theprotrusions 56-58 of the planarizing layer 53 through via holes 82-84,respectively. One or more layers 90 of insulating material 18 are thenapplied over the completed coil 19. Connecting means such as via hole100 is formed therein, e.g., by conventional photomask patterning, forlater electrical access to the lower pole piece 22 by upper pole piece23, which is subsequently plated on layers 90 over a portion of theinsulated coil 19.

FIG. 10 is a composite of FIGS. 7-9 showing the relationships of thelower pole piece 22, planar sections 86-88 of the planarizing layer, theinductive coil 19 and terminal pad connectors 96-99. FIG. 11 shows acenter-rail terminal pad arrangement appropriate for the read-writestructure just described.

Another preferred embodiment of a planarizing layer is shown in FIGS.12(a) and (b). As in the configuration of FIG. 5(a), conductive element86 is electrically coupled to a first MR lead 51 (not shown), element 87is coupled to the inner coil tap 27, and element 88 is coupled to asecond MR lead 52 (not shown). But in contrast to that design, theembodiment of FIG. 12(b) facilitates a terminal pad arrangement in whichboth read terminal pads 120, 121 are disposed on the same side of theread/write structure, and both write terminal pads 122, 123 are disposedon the other side. One possible interconnection is shown in FIG. 12(b).It should be understood that the mirror images of FIGS. 12(a) and (b)provide yet another suitable center-rail design. First read terminal pad120 is connected to contact point 106 of conductive element 86 viaconnector 124. The second read terminal pad 121 adjacent to first readterminal pad 120 is coupled to conductive element 88 at a convenientcontact point 107 proximate to the pad 121 by connector 125. First writeterminal pad 122 has access to inner coil tap 27 (not shown) viaconnector 126, which is coupled to conductive element 87 at easilyaccessible contact point 108. Second write terminal pad 123 connects toouter coil tap 37 (not shown) by connector 127.

FIGS. 13(a) and (b) illustrate another preferred embodiment of aplanarizing layer of the present invention, in this instance easilyfacilitating a number of possible terminal pad arrangements. As before,conductive elements 86-88 are coupled to MR lead 51, inner coil tap 27,and MR lead 52, respectively. Each conductive element 86-88 has twoprotrusions extending out from opposing sides of the subsequently-formedinductive coil 19 (not shown). Conductive element 86 includes a pair ofprotrusions 133, 134. Similarly, conductive element 87 includesprotrusions 136, 137 and conductive element 88 includes protrusions 131,132. Referring to FIG. 13(b), it should be understood by those ofordinary skill in the art that a WRRW center-rail arrangement isachieved by connecting terminal pads 138-141 to contact points 136, 133,132 and outer coil tap 37, respectively. Alternatively, one RRWWconfiguration is possible by connecting terminal pads 138-141 to contactpoints 133, 131, 137 and outer coil tap 37, respectively. Thus eitherterminal pad arrangement is facilitated by the planarization layerdesign of FIGS. 13(a) and (b).

It should be understood that the planarizing layer arrangements of FIGS.8, 11, and 12 are only exemplary and that other arrangements in theplane of the first pole piece 22 in an MR/inductive write head assemblydo not depart from the spirit and scope of the underlying invention. Forexample, a planarizing layer may be utilized in an inductive head, a"merged" head, a "piggy-back" head, or other MR/inductive write headcombination having a protruding lower pole piece. In addition, anynumber of nonconductive or conductive materials may be used to achieveplanarization, although the use of conductive materials such as copperprovides the additional benefits associated with reduced MR lead sizeand avoidance of an overpass connector. Furthermore, any number ofconductive or nonconductive elements in any number of suitablearrangements may form the planarizing layer around first pole piece 22.Such arrangements may or may not provide electrical access to the MRleads 51, 52 and/or inner coil tap 27 by the terminal pads. If they doprovide such a function, they may provide protrusions extending out fromunder the coil to facilitate a number of possible terminal padarrangements, including adaptations for both center and side-rail sliderdesigns.

FIGS. 14(a)-(d) show one embodiment of a planarizing layer adapted to aside-rail slider design. The dotted lines 161-164 of FIG. 14(a) indicatethe connections which would provide a RRWW arrangement of terminal pads138-141. FIGS. 14(b)-(d) similarly indicate the connections for WWRR,WRRW and RWWR configurations, by dashed lines 165-176. It will beunderstood that the examples shown are illustrative rather thanexhaustive.

FIG. 15 shows a magnetic disk storage system incorporating anMR/inductive write head assembly according to the present invention.Although the invention is described as embodied in a magnetic diskstorage system as shown in FIG. 15, it should be apparent that theinvention is also applicable to other magnetic recording systems such asa magnetic tape recording system, for example, or other applicationsutilizing an inductive write head in combination with a magnetoresistiveread head. A magnetic disk storage system comprises at least onerotatable magnetic disk 142 supported on a spindle 144 and rotated by adisk drive motor 148 with at least one slider 143 positioned on the disk142, each slider 143 supporting one or more magnetic read/write heads151. The magnetic recording media on each disk is in the form of anannular pattern of concentric data tracks (not shown) on disk 142. Asthe disks rotate, the sliders 143 are moved radially in and out over thedisk surface 152 so that the heads 151 may access different portions ofthe disk where desired data is recorded. Each slider 143 is attached toan actuator arm 149 by means of a suspension 145. The suspension 145provides a slight spring force which biases the slider 143 against thedisk surface 152. Each actuator arm 149 is attached to an actuator means157. The actuator means as shown in FIG. 15 may be a voice coil motor(VCM), for example. The VCM comprises a coil moveable within a fixedmagnetic field, the direction and velocity of the coil movements beingcontrolled by the motor current signals supplied by a controller.

During operation of the disk storage system, the rotation of the disk142 generates an air bearing between the slider 143 and the disk surface152 which exerts an upward force or lift on the slider. The air bearingthus counterbalances the slight spring force of the suspension 145 andsupports the slider 143 off and slightly above the disk surface by asmall, substantially constant spacing during operation.

The various components of the disk storage system are controlled inoperation by control signals generated by control unit 159, such asaccess control signals and internal clock signals. Typically, thecontrol unit 159 comprises logic control circuits, storage means and amicroprocessor, for example. The control unit 159 generates controlsignals to control various system operations such as drive motor controlsignals on line 153 and head position and seek control signals on line158. The control signals on line 158 provide the desired currentprofiles to optimally move and position a selected slider 143 to thedesired data track on the associated disk 142. Read and write signalsare communicated to and from read/write heads 151 by means of recordingchannel 155.

The above description of a typical magnetic disk storage system, and theaccompanying illustration of FIG. 15 are for representation purposesonly. It should be apparent that disk storage systems may contain alarge number of disks and actuators, and each actuator may support anumber of sliders.

We claim:
 1. An inductive head assembly formed on a substantially planarfirst surface, comprising:a lower pole piece formed over a first portionof said first surface, having a first pole tip and a first back gapportion; at least two electrically isolated planar sections ofconductive material formed over a second portion of said first surfacein close proximity to and substantially coplanar with said lower polepiece to provide therewith a substantially planar second surface; a coilformed over said substantially planar second surface, wherein the centerof said coil is disposed over said first back gap portion; and an upperpole piece formed over a portion of said coil, said upper pole piecehaving a second pole tip and a second back gap portion connected to saidfirst back gap portion through said center of said coil, wherein saidfirst and second pole tips form a write gap.
 2. The inductive headassembly of claim 1, further comprising means for electrically isolatingsaid at least one planar section from said lower pole piece.
 3. Theinductive head assembly of claim 2, wherein said isolating means furthercomprises a gap formed between said at least one planar section and saidlower pole piece.
 4. The inductive head assembly of claim 2, whereinsaid isolating means further comprises insulating material formedbetween said at least one planar section and said lower pole piece. 5.The inductive head assembly of claim 1, further comprising means forelectrically insulating said at least one planar section from said coil.6. The inductive head assembly of claim 5, wherein said insulating meansfurther comprises an insulating layer formed between said planarizinglayer and said coil.
 7. The inductive head assembly of claim 1, furthercomprising means for electrically insulating said upper pole piece fromsaid coil.
 8. The inductive head assembly of claim 7, wherein saidinsulating means further comprises an insulating layer formed betweensaid coil and said upper pole piece.
 9. The inductive head assembly ofclaim 1, wherein said at least one planar section is formed byelectro-plating, sputtering, or chemical vapor deposition.
 10. Theinductive head assembly of claim 1, wherein said at least one planarsection comprises at least one material selected from the groupconsisting of: Cu, Au, Pt, Ta, Ti, Rh, Ru, Ag, Pd, W and NiFe.
 11. Theinductive head assembly of claim 1, further comprising an inner coil tapproximate to the center of said coil, and means for electricallycoupling one of said at least two planar sections to said inner coiltap, wherein said one planar section further comprises a conductiveportion extending from the outer perimeter of said coil for providingelectrical access to said inner coil tap.
 12. The inductive headassembly of claim 1, wherein said isolating means further comprises gapsformed between said at least two planar sections.
 13. The inductive headassembly of claim 1, wherein said isolating means further comprisesinsulating material formed between said at least two planar sections.14. The inductive head assembly of claim 1, wherein each of said atleast two planar sections further comprises a conductive portionextending from the outer perimeter of said coil.
 15. The inductive headassembly of claim 1, wherein said coil further comprises an outer coiltap on a first side of its outer perimeter, and wherein each of said atleast two planar sections further comprises a first conductive portionextending from said first side of said outer perimeter, and a secondconductive portion extending from the opposite side of said perimeter.16. The inductive head assembly of claim 1, wherein said substantiallyplanar first surface is an upper surface of a read head subassemblycomprising a lower and an upper shielding layer defining a read gaptherebetween, and an MR element formed between said upper and lowershielding layers and substantially vertically aligned with said firstand second pole tips, said MR element including first and second MRleads.
 17. The inductive head assembly of claim 16, wherein said lowerpole piece is said upper shielding layer.
 18. The inductive headassembly of claim 17, further comprising means for electricallyinsulating said MR element and said MR leads from said upper and lowershielding layers.
 19. The inductive head assembly of claim 18, whereinsaid insulating means further comprises a nonconductive gap materialformed between said first and second shielding layers.
 20. The inductivehead assembly of claim 17, further comprising at least two planarsections formed between said first surface and said coil, means forelectrically isolating said at least two planar sections from oneanother, and means for electrically coupling a first and a second ofsaid at least two planar sections to said first and second MR leads,respectively, each of said first and second planar sections furthercomprising a conductive portion extending from the outer perimeter ofsaid coil for providing electrical access to said first and second MRleads.
 21. The inductive head assembly of claim 20, wherein the combinedarea of said first and second MR leads is smaller than the area of saidcoil, and wherein said MR leads are disposed entirely within said coilperimeter.
 22. The inductive head assembly of claim 20, wherein saidcoil further comprises an inner coil tap proximate to its center, andfurther comprising means for electrically coupling a third of said atleast two planar sections to said inner coil tap, said third planarsection further comprising a conductive portion extending from the outerperimeter of said coil for providing electrical access to said innercoil tap.
 23. The inductive head assembly of claim 22, wherein said coilfurther comprises an outer coil tap on a first side of its outerperimeter, and wherein each of said first, second, and third planarsections further comprises a first conductive portion extending fromsaid first side of said outer perimeter, and a second conductive portionextending from the opposite side of said perimeter.
 24. An integratedmagnetic head assembly formed on one end of a slider, comprising:firstand second read terminal pads and first and second write terminal padsformed in a predetermined arrangement on said one end; a read headsubassembly comprising a lower and an upper shielding layer defining aread gap therebetween, and an MR element formed between said upper andlower shielding layers, said MR element including first and second MRleads electrically coupled thereto means for electrically coupling saidfirst and second MR leads to said first and second read terminals,respectively; a write head assembly formed over said read headsubassembly, comprising,a lower pole piece formed over a first portionof said read head subassembly, having a first pole tip and a first backgap portion, at least two electrically isolated planar sections ofconductive material formed over a second portion of said read headsubassembly in close proximity to and substantially coplanar with saidlower pole piece to provide therewith a substantially planar secondsurface, a coil formed over said substantially planar second surface,wherein the center of said coil is disposed over said first back gapportion, said coil including an inner coil tap formed proximate to itscenter, and an outer coil tap formed at its perimeter, and an upper polepiece having a second pole tip and a second back gap portion connectedto said first back gap portion through said center of said coil, whereinsaid first and second pole tips form a write gad therebetween; and meansfor electrically coupling said inner and outer coil taps to said firstand second write pads, respectively.
 25. The magnetic head assembly ofclaim 24, further comprising means for electrically isolating said atleast one planar section from said lower pole piece.
 26. The magnetichead assembly of claim 25, wherein said isolating means furthercomprises a gap formed between said at least one planar section and saidlower pole piece.
 27. The magnetic head assembly of claim 25, whereinsaid isolating means further comprises insulating material formedbetween said at least one planar section and said lower pole piece. 28.The magnetic head assembly of claim 24, further comprising means forelectrically insulating said at least one planar section from said coil.29. The magnetic head assembly of claim 28, wherein said insulatingmeans further comprises an insulating layer formed between saidplanarizing layer and said coil.
 30. The magnetic head assembly of claim24, further comprising means for electrically insulating said upper polepiece from said coil.
 31. The magnetic head assembly of claim 30,wherein said insulating means further comprises an insulating layerformed between said coil and said upper pole piece.
 32. The magnetichead assembly of claim 24, wherein said at least one planar section isformed by electro-plating, sputtering, or chemical vapor deposition. 33.The magnetic head assembly of claim 24, wherein said at least one planarsection comprises at least one material selected from the groupconsisting of: Cu, Au, Pt, Ta, Ti, Rh, Ru, Ag, Pd, W and NiFe.
 34. Themagnetic head assembly of claim 24, wherein one of said at least twoplanar sections further comprises a conductive portion extending fromthe outer perimeter of said coil, and wherein said means for couplingsaid inner coil tap to said first write pad terminal furthercomprises:means for electrically coupling said one planar section tosaid inner coil tap; and means for electrically coupling said extendedconductive portion to said first write terminal pad.
 35. The magnetichead assembly of claim 24, wherein said lower pole piece is said uppershielding layer.
 36. The magnetic head assembly of claim 24, furthercomprising means for electrically insulating said MR element and said MRleads from said upper and lower shielding layers.
 37. The magnetic headassembly of claim 36, wherein said insulating means further comprises anonconductive gap material formed between said first and secondshielding layers.
 38. The magnetic head assembly of claim 24, whereinsaid isolating means further comprises gaps formed between said at leasttwo planar sections.
 39. The magnetic head assembly of claim 24, whereinsaid isolating means further comprises insulating material formedbetween said at least two planar sections.
 40. The magnetic headassembly of claim 24, wherein a first and a second of said at least twoplanar sections each further comprises a conductive portion extendingfrom the outer perimeter of said coil, and wherein said means forelectrically coupling said first and second MR leads to said first andsecond read terminal pads, respectively, further comprises:means forelectrically coupling said first planar section to said first MR lead;means for electrically coupling said second planar section to saidsecond MR lead; means for electrically coupling said extended conductiveportion of said first planar section to said first read terminal pad;and means for electrically coupling said extended conductive portion ofsaid second planar section to said second read terminal pad.
 41. Themagnetic head assembly of claim 40, wherein the combined area of saidfirst and second MR leads is smaller than the area of said coil, andwherein said MR leads are disposed entirely within said coil perimeter.42. The magnetic head assembly of claim 40, wherein a third of said atleast two planar sections further comprises a conductive portionextending from the outer perimeter of said coil, and wherein said meansfor electrically coupling said inner coil tap to said first writeterminal pad, further comprises:means for electrically coupling saidthird planar section to said inner coil tap; and means for electricallycoupling said extended conductive portion of said third planar sectionto said first write terminal pad.
 43. The magnetic head assembly ofclaim 42, wherein said conductive portion of said third planar sectionextends from the same side of said coil as said outer coil tap, andwherein said conductive portions of said first and second planarsections extend from the opposite side of said coil.
 44. The magnetichead assembly of claim 42, wherein said conductive portion of one ofsaid first and second planar sections extends from the same side of saidcoil as said outer coil tap, and wherein said conductive portions of theother of said first and second planar sections and of said third planarsection extend from the opposite side of said coil.
 45. The magnetichead assembly of claim 42, wherein said conductive portions of saidfirst, second and third planar sections extend from the same side ofsaid coil as said outer coil tap.
 46. The magnetic head assembly ofclaim 24, a first, a second, and a third of said at least two planarsections each further comprises a first conductive portion extendingfrom the same side of said coil as said outer coil tap, and a secondconductive portion extending from the opposite side of said coil. 47.The magnetic head assembly of claim 24, wherein said read headsubassembly and said write head assembly are positioned centrally onsaid trailing edge.
 48. The magnetic head assembly of claim 47, whereinsaid first and second read terminal Dads are formed on one side of saidcoil on said trailing edge, and said first and second write terminalpads are formed on the other side of said coil on said trailing edge.49. The magnetic head assembly of claim 47, where in one of said firstand second read terminal pads and one of said first and second writeterminal pads is formed on one side of said coil on said trailing edge,and the other of said first and second read terminal pads and the otherof said write terminal pads is formed on the other side of said coil onsaid trailing edge.
 50. The magnetic head assembly of claim 24, whereinsaid read head subassembly and said write head assembly are formed toone side on said trailing edge and said read and write terminal pads areformed to the other side.
 51. A data storage system comprising:amagnetic storage medium having a recording surface for storinginformation thereon; a slider, including a trailing end; an integratedmagnetic head assembly formed on said trailing end of a slider andadapted for reading information from and writing information to saidrecording surface, comprising,first and second read terminal pads andfirst and second write terminal pads formed in a predeterminedarrangement on said trailing end, a read head subassembly comprising alower and an upper shielding layer defining a read gap therebetween, andan MR element formed between said upper and lower shielding layers, saidMR element including first and second MR leads electrically coupledthereto and extending therefrom through said read gap, a write headassembly formed over said read head subassembly, comprising,a lower polepiece formed over a first portion of said read head subassembly, havinga first pole tip and a first back gap portion, a plurality ofelectrically isolated planar sections of conductive material formed overa second portion of said read head subassembly in close proximity to andsubstantially coplanar with said lower pole piece to provide therewith asubstantially planar second surface, a coil formed over saidsubstantially planar second surface, wherein the center of said coil isdisposed over said first back gap portion, said coil including an innercoil tap formed proximate to its center and an outer coil tap formed atits outer perimeter, wherein a first, a second, and a third of saidplurality of planar sections each comprises a conductive portionextending from the outer perimeter of said coil, and an upper pole piecehaving a second pole tip and a second back gap portion connected to saidfirst back gap portion through the center of said coil, wherein saidfirst and second pole tips form a write gap therebetween substantiallyvertically aligned with said read gap, means for electrically couplingsaid first planar section to said first MR lead, means for electricallycoupling said second planar section to said second MR lead, means forelectrically coupling said extended conductive portion of said firstplanar section to said first read terminal pad, means for electricallycoupling said extended conductive portion of said second planar sectionto said second read terminal pad, means for electrically coupling saidthird planar section to said inner coil tap, means for electricallycoupling said extended conductive portion of said third planar sectionto said first write terminal pad, and means for electrically couplingsaid outer coil tap to said second write terminal pad; means forproviding relative motion between said magnetic head assembly and saidrecording surface; and means for selectively positioning said slider inclose proximity to said recording surface to facilitate said reading andwriting of said information.